PCB assembly capability
Package support, assembly processes, test coverage, and volume range for our SMT, THT, and turnkey lines.
SMT & THT specifications
| Capability | Specification |
|---|---|
| Min passive package | 01005 (0402 metric) |
| BGA support | 0.3 mm pitch, up to 2,500+ balls, microBGA |
| QFN support | 0.35 mm pitch, thermal-pad voiding control by X-ray |
| QFP support | 0.3 mm pitch |
| Connectors & odd-form | Fine-pitch FPC/FFC, press-fit, board-to-board |
| THT capability | Wave, selective, and manual soldering; press-fit |
| Mixed assembly | SMT + THT single and double-sided, selective pallets |
| Flex pcb assembly | Dedicated carriers, low-temp profiles, stiffener handling |
| Board size range | 50 × 50 mm – 510 × 460 mm |
| Placement accuracy | ±25 μm @ Cpk 1.0 |
| Volume range | 1 pc engineering samples – 50k+ pcs/month |
Testing & inspection methods
SPI
3D solder paste inspection before placement — volume, area, and alignment on every pad.
AOI
Pre- and post-reflow automated optical inspection for presence, polarity, tombstoning, and solder defects.
X-Ray
BGA, QFN, and hidden-joint inspection with voiding analysis; images archived per lot.
ICT & Flying Probe
In-circuit test fixtures for production; flying probe for prototypes and low volume without tooling cost.
Functional Test
Custom FCT developed with your team — firmware flashing, boundary scan, and end-of-line validation.
Engineering Support
DFA review, stencil design, reflow profiling, and failure analysis feedback loops on every program.
Assembly equipment highlights
Solder Paste Printing
SMT Placement
Reflow Soldering
AOI Inspection
X-Ray (BGA / QFN)
THT / DIP Lines
Functional Test (FCT)
First Article InspectionPut these capabilities to work
Send Gerbers + BOM for a DFA review and quotation within 24 hours.