• Home
  • PCB News
  • Rogers executives predict that the high-frequency PCB miniaturization

Rogers executives predict that the high-frequency PCB miniaturization


Wireless infrastructure needs dequate low insertion loss, in order to effectively improve energy efficiency. With the advent of 4G services, products need to provide a wider RF bandwidth, and is backward compatible with 3G, 2G services. Meanwhile, the base becomes increasingly smaller and lighter, and installed to the top of the tower, which also prompted to develop miniaturized printed circuit boards(PCB). 

In terms of tablet PCs and other handheld devices, many PCB manufacturers are looking for ways to make the antenna miniaturization material. Many handheld device contains an antenna (Bluetooth, Wi-Fi, cellular and GPS), the antennas installed in a small space, and can not interfere with each other. Meanwhile, each company is different with antenna design, you need to have flexibility. This is a high requirements for circuit board material made. 

To address these needs, Rogers has developed a RO4360G2 product, compared with the first generation of products, higher relative thermal index) high frequency circuit board materials, RO4 835 high-frequency PCB material, RO4700JXR series  antenna grade laminates and RO3010 high dielectric constant materials and other products. Rogers, vice president of Asia-Pacific Markets Company Liu Jianjun, said: "These products have been made based on few customers demand, but when the product launch, there are many customers became interested in this." 

Rogers Advanced PCB Materials Division Asia Pacific market development manager Yang Xi, said the application of high-frequency PCB is very broad and can cover most of the market applications: base station amplifier design requirements used in high-power, low insertion loss of material; antenna applications require a certain hardness of the plate, and there are very good indicators of passive intermodulation; automotive applications require sheet with long-term reliability, and can withstand high temperatures; application types on mobile phones and high-speed circuit is also very rich. 

Insertion loss performance and heat dissipation are very essential for Amplifier design . Rogers has a RO3035 HTC plates, which insertion loss is 0.0017, the thermal conductivity of 1.44, ideal for power amplifier applications. Small insertion loss means less heat generated, plus good thermal conductivity, the heat can be dissipated quickly, so that the surface temperature of the circuit board and the amplifier tube temperature. 

 Yang Xi said the development trend of the high frequency PCB is to provide lower insertion loss, better cooling, wider bandwidth, higher rates. Rogers made a lot of sense this year to try, such as the introduction of higher dielectric constant sheet, its optional range of 1.96 to 10.2. Whether it is to reduce the size and increase isolation, or want to enhance heat dissipation throughout the amplifier, you can find the products at Rogers PCB series.