By J. P. Den Hartog
This excellent textual content bargains complicated undergraduates and graduate scholars a piece of intermediate trouble that includes quite a few issues of entire solutions. It explores torsion, rotating disks, membrane stresses in shells, bending of flat plates, beams on elastic starting place, 2-dimensional concept of elasticity, the power tools, and buckling. 1952 version.
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Extra info for Advanced Strength of Materials (Dover Books on Engineering)
Pressure sensors add some Thin diaphragm Ref. 5 MEMS pressure sensors. Beam under tension (freq2) 38 Chapter Two level of challenge to packaging, since the force of external pressure must be conveyed to the sensing elements within the device. 3 Chemical sensors The ability to detect specific chemicals and even biological agents is one of the most important developing areas for MEMS. Several types are available and more will undoubtedly be developed and announced. The simplest concept uses a surface that will absorb a specific molecule such as carbon monoxide (CO).
Some can even be processed at 100οC. Since thermoset adhesives cannot melt after curing, they are not reworkable, but they will not melt during solder reflow and can be used for FC assembly within a package. 5 Routing Package routing for electronic chips only involves paths for electrons. MEMS may also need electronic routing. But since MEMS can also deal with materials, the package may also need to route gases, liquids, and Engineering Fundamentals of MEMS and MOEMS Electronic Packaging 15 perhaps even solids.
3. , “Challenges in MEMS Packaging,” Proceedings, SMTA International, September 24–28, 2000 [CD-ROM; no pages] Chicago, Ill. 4. , “MEMS & MOEMS Packaging Challenges,” J. Mat. Processing & Manufacturing Science, Vol. 8, No. 4, pp. 361–379. 5. , “MEMS Packaging Solutions,” EP&P, pp. 49–50, 52–53, 55–56, June 2000. 6. , “MOEMS the Word,” Circuits Assembly, pp. 28–31, 33, 34, Nov. 2000. 7. gov/ - Enter “MEMS reliability” in home page search engine for several hundred reports. Chapter 2 Principles, Materials, and Fabrication of MEMS and MOEMS Devices This chapter will begin by describing and defining micromechanical devices.
Advanced Strength of Materials (Dover Books on Engineering) by J. P. Den Hartog