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Advanced MEMS packaging - download pdf or read online

By John H. Lau ... [et al.]

ISBN-10: 0071626239

ISBN-13: 9780071626231

ISBN-10: 0071627928

ISBN-13: 9780071627924

ISBN-10: 0071741836

ISBN-13: 9780071741835

ISBN-10: 1615831592

ISBN-13: 9781615831593

Advent to MEMS --
Advanced MEMS packaging --
Enabling applied sciences for complicated MEMS packaging --
Advanced MEMS wafer-level packaging --
Optical MEMS packaging : communications --
Optical MEMS packaging : bubble change --
Optical MEMS : microbolometer packaging --
Bio-MEMS packaging --
Biosensor packaging --
Accelerometer packaging --
Radiofrequency MEMS switches --
RF MEMS tunable capacitors and tubable band-pass filters --
Advanced packaging of RF MEMS units

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Extra resources for Advanced MEMS packaging

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B. (Northville, MI), “On-wafer packaging for RFMEMS,” February 24, 2004. Chinthakindi, Anil K. (Fishkill, NY), Groves, Robert A. (Highland, NY), Stein, Kenneth J. (Sandy Hook, CT), Subbanna, Seshadri (Brewster, NY), Volant, Richard P. (New Fairfield, CT), “Microelectromechanical varactor with enhanced tuning range,” February 24, 2004. Chinthakindi, Anil K. (Poughkeepsie, NY), Groves, Robert A. (Highland, NY), Stein, Kenneth J. (Sandy Hook, CT), Subbanna, Seshadri (Brewster, NY), Volant, Richard P.

With minimum damping and stiction) in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. , resonators, infrared bolometers, and gyroscopes), vacuum packaging is even required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a waferlevel packaging. The design, materials, process, testing, and reliability of MEMS wafer-level packaging will be presented, discussed, and examined throughout this book. 6 MEMS Packaging Patents since 2001 In the past few years, many patents have been granted for MEMS packaging.

MEMS packaging method for enhanced EMI immunity using flexible substrates,” Wang, Zhe (SG), Miao, Yubo (SG), US2007013052 (A1)—2007-01-18. 108. “Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging,” Nasiri, Steven S. , Jr. (US), US2007012653 (A1)—2007-01-18. 33 34 Chapter One 109. “Method and system for packaging MEMS devices with incorporated getter,” Palmateer, Lauren (US), Cummings, William J. (US) (+3), KR20060092914 (A)—2006-08-23.

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Advanced MEMS packaging by John H. Lau ... [et al.]


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